Silicon wafers must be marked with lasers during the manufacturing process. Semiconductor packages can be permanently marked using an optical laser machine.
There is more to lasers than just words. An atom is stimulated by a laser, which generates specialized light particles that are targeted at precise locations. The laser is sometimes referred to as an “Light Amplification by Stimulated Emission of Radiation.” Marking lasers can be used to do this accurately.
As a result of laser marking, it is possible to keep track of wafers during the entire manufacturing process. In order to achieve this, the Lasit Laser markings will need to be automatically read by an automated system. It is also important that the marking does not adversely affect the underlying processes, and that the wafer does not suffer any damage as a result of the marking. The importance of keeping it perfect cannot be overstated. A key part of our process involves laser marking silicon wafers.
How do silicon wafers get made?
There is nothing complicated about laser marking. Lasers are used to mark wafers so they can be identified. Electronic devices use wafers almost exclusively, just as semiconductors do. There is a flat surface, a circular shape, and a mirrored appearance to them.
Performing laser marking on silicon wafers requires extreme care due to the absence of impurities.
Annexes with laser enhancements
It is possible to heat surfaces extremely efficiently during annealing by using a laser beam. Under the surface of the skin, oxygen diffuses due to heat (oxidation). A color change can be seen once everything has cooled down.
A product that has been annealed can have a yellow, red, or green color. It is possible for this color to change depending on the temperature during the marking process. In order to determine whether the temperature increases or decreases, three variables must be taken into account:
- The pulse’s intensity
- Light speed
- After each line, there is a pass
It is possible to render characters as small as millimeters tall using these lasers. During annealing, silicon-based wafers are marked with lasers because of their excellent results.
Using a Laser Marker: The Basics
It is necessary to use computers to mark silicon wafers. During this stage of the process, the wafer map is displayed on the marking document. A description of the parameters, functions, and so on can be found there. In the other corner of the screen, the data is displayed as a preview of how it will be translated into silicon.
Laser marking machines are set up so that the wafer can be placed inside after they have been set up properly. Wafers are picked up and brought to the marking station by mechanical hand. Processes that are automated do not need human intervention at any point in the process.
Lasers are directed at the wafer surface once the machine locates its target location. A receiving box will be used to receive the project, which will then be removed.
There are a number of benefits to laser marking
Precision-Oriented
Since laser marking is precise, it makes sense to use it for manufacturing wafers. It captures even the tiniest details perfectly and accurately thanks to its superior technology. It is possible to track silicon wafers simply by reading the markings on the wafer that are as small as a millimeter.
Speedy
In addition to being fast and precise, laser marking is also extremely precise. From placement to marking to completion, entire silicon wafer stacks are marked in minutes. The laser annealing process is slower, but the results are superb and no residue is left behind.
Applicable only to the surface
The laser marking of silicon wafers does not actually remove any material from them. The material underneath the surface is only changed in color. There are no changes to the conditions.
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